(11*7.4 for RO chip)
Bump Bond
Amp
Discri
Logic(Time Stamp, Sparce Data Scan, etc.)
Amp
A-SW
A-SW
Simple
| Type | MOS Sensor | CCD | ||
|---|---|---|---|---|
| Hybrid | Monolithic | |||
| Active(APS) | Non-Active | |||
| Where? | ATLAS | Hawaii Univ. | (Vedeo Camera) | SLD |
| Chip Size (mm) | 16.4*60.4 (11*7.4 for RO chip) | ~1*1 | 16*80 | |
| Pixel Size (um) | 50*500 | 34*125 | 22*22 | |
| Pixel Function | PD Bump Bond Amp Discri Logic(Time Stamp, Sparce Data Scan, etc.) | PD Amp A-SW | PD A-SW | PD |
| Structure | ComplicatedSimple
| |||
| Disadvantage | thick | small size | bad S/N | radiation damage |