Construction of prototype sensors and ladders which can achieve an impact parameter resolution of
≤ 5 ⊕ 10/(pβsin
θ) μ m
To achieve the target above we need study onG
Thinning of CCD wafers to minimize the multiple scattering.
The support structure for the thin wafers is also needed.
Radiation tolerance which enables us to put the detector as close to the IP as possible.
Multiport readout of the CCD compatible with the required readout speed of the vertex detector at LC experiments. The multiport readout also contributes to the improvement of the radiation tolerance.
Readout ASIC for the multiport readout
: Basic study
2nd year: Detailed design of prototypes and make an order
3ed year: Prototypes delivery and tests